30 Sep 2008
MIPTEC (Microscopic Integrated Processing Technology) from Panasonic Electric Works has revolutionized developing miniature components for applications in which space is extremely limited.
The underlying principle is to incorporate all necessary components and functions in a single package, i.e. to combine mechanical, electrical and even optical functions on an injection-molded carrier.
This proprietary technology has succeeded in applying a metallic layer (Cu/Ni/Au plating) to a plastic or ceramic substrate that can be patterned with pinpoint accuracy using lasers (70m track/space width). This carrier functions as a 3-dimensional circuit to whose surface SMD components, sensor elements or even bare dies can be connected. The substrate can easily stand up to reflow soldering enabling mass soldering of SMD components. The quality of the plating is very smooth and can be used with the gold wire bond process common in the industry. Panasonic’s experience in the fine pitch connector business has led to outstanding corrosion resistance, which allows you to develop applications even for adverse environments.
With this ingenious technology, smaller, thinner designs are possible, and reliability improves because fewer interconnections are required, e.g. cables, connectors, flexible PCBs. For complex mechanical designs, the assembly effort can be reduced drastically.
Areas of particular relevance include medical, consumer and automotive markets, where compact modules and sensors with superior reliability are essential. In many cases, component size can be reduced by a factor of 10 without compromising functionality.
Panasonic established MIPTEC technology more than 10 years ago, arming you now for the future.
For more information please send us an e-mail.
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